The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2003
Filed:
May. 22, 2000
Jürgen Högerl, Regensburg, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A semiconductor module has a plurality of semiconductor chips which are provide on chip carriers in a housing. At least some of the semiconductor chips are disposed one above the other and there are conductive connections between the chip carriers of the semiconductor chips disposed one above the other. The conductive connections are formed by plug-in connections and extend through openings in the chip carriers. The openings may be lined with a conductive layer. In an alternative embodiment intermediate layers are provided between the semiconductor chips disposed one above the other. The intermediate layers have conductive projections which engage in the openings in the chip carriers for forming conductive connections.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile