The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2003
Filed:
Apr. 10, 2001
Jürgen Högerl, Regensburg, DE;
Stefan Paulus, Zeitlarn, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A housing for semiconductor chips includes a plastic base substrate having a region for accommodating a chip and substrate sides having a patterned metallization layer. One of the sides contacts a chip and another contacts an external electrical connection. Each chip has front and rear sides and at least one chip contact on each side. Two or more pads are formed in the patterned metallization layer on one of the base substrate sides. One of the pads is connected to a front side chip contact and another is connected to a rear side chip contact. At least one pad is formed in the patterned metallization layer on the other base substrate side and is connected to the external electrical connection. One of the two pads is connected to a chip contact through the bonding wire, and another of the two pads is directly applied to another chip contact.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile