Pfaffnau, Switzerland

Jürg Schwizer


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Jürg Schwizer: Innovator in Wire Bonding Technology

Introduction

Jürg Schwizer is a notable inventor based in Pfaffnau, Switzerland. He has made significant contributions to the field of wire bonding technology, particularly through his innovative patent. His work has implications for the semiconductor industry, enhancing the efficiency and accuracy of wire bonding processes.

Latest Patents

Jürg Schwizer holds a patent for a "Method for the calibration of a wire bonder." This invention involves a wire bonder equipped with a capillary clamped to a horn. An ultrasonic transducer applies ultrasonics to the horn, which is controlled by a parameter P. For the calibration of this parameter, a piezoresistive sensor integrated into a semiconductor chip is utilized. The capillary is lowered onto the semiconductor chip, and a bond force is applied. Once the transient reaction concludes, the output signal of the sensor is stored as the reference value U. This method ensures that the bond force is sufficient to prevent the capillary from sliding back and forth. The wire bonder can be recalibrated after changing the capillary by determining a correction factor, ensuring optimal performance.

Career Highlights

Jürg Schwizer has been associated with Esec Trading SA, where he has applied his expertise in wire bonding technology. His innovative approach has led to advancements in the calibration methods used in the industry. His work is recognized for its technical depth and practical applications.

Collaborations

Jürg Schwizer collaborates with Michael Mayer, contributing to the development and refinement of wire bonding technologies. Their partnership has fostered innovation and improved methodologies in their field.

Conclusion

Jürg Schwizer's contributions to wire bonding technology through his patent demonstrate his commitment to innovation in the semiconductor industry. His work continues to influence the efficiency and accuracy of wire bonding processes, marking him as a significant figure in this domain.

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