Esec, Trading Sa

J&uuml;rg Schwizer

Michael Mayer

A Wire Bonder has a capillary clamped to a horn. An ultrasonic transducer applies ultrasonics to the horn whereby the ultrasonic transducer is controlled by a parameter P. For calibration of the parameter P, a pizoresistive sensor integrated into a semiconductor chip is used. The capillary is lowered onto the semiconductor chip and a bond force is applied to it. Afterwards, a value P of the parameter P is applied to the ultrasonic transducer and the output signal of the sensor is stored as the reference value U as soon as the transient reaction is concluded. The bond force is selected great enough so that the capillary does not slide back and forth. The Wire Bonder, for example after changing the capillary, is then recalibrated in that a correction factor &ggr; is analogously determined so that the amplitude of the sensor signal assumes the value U when the ultrasonic transducer is operated with the value P &equals;&ggr;*P .

Growing community of inventors

Pfaffnau, Switzerland

Jürg Schwizer

Growing community of inventors

Pfaffnau, Switzerland

J&uuml;rg Schwizer

Jürg Schwizer