The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2003
Filed:
May. 30, 2002
Michael Mayer, Neuheim, CH;
Jürg Schwizer, Pfaffnau, CH;
ESEC Trading SA, Cham, CH;
Abstract
A Wire Bonder has a capillary clamped to a horn. An ultrasonic transducer applies ultrasonics to the horn whereby the ultrasonic transducer is controlled by a parameter P. For calibration of the parameter P, a pizoresistive sensor integrated into a semiconductor chip is used. The capillary is lowered onto the semiconductor chip and a bond force is applied to it. Afterwards, a value P of the parameter P is applied to the ultrasonic transducer and the output signal of the sensor is stored as the reference value U as soon as the transient reaction is concluded. The bond force is selected great enough so that the capillary does not slide back and forth. The Wire Bonder, for example after changing the capillary, is then recalibrated in that a correction factor &ggr; is analogously determined so that the amplitude of the sensor signal assumes the value U when the ultrasonic transducer is operated with the value P =&ggr;*P .