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Cham, Switzerland

Esec, Trading Sa

USPTO Granted Patents = 38

% Expired Patents = 84.2

Forward Citations = 143

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44 inventors (with patents filed for the assignee):

Eugen Mannhart (5 out of 6 patents)

Michael Mayer (4 out of 4 patents)

Peter Hess (4 out of 5 patents)

4. Silvan Thuerlemann (3 out of 5 patents)

5. Nicolino Onda (3 out of 3 patents)

6. Reto Schubiger (3 out of 3 patents)

7. Markus Michler (2 out of 4 patents)

8. Alexander Greber (2 out of 4 patents)

9. Christof Koster (2 out of 4 patents)

10. Stefan Behler (2 out of 6 patents)

11. Jonathan Medding (2 out of 4 patents)

12. Dieter Vischer (2 out of 5 patents)

13. Martin Melzer (2 out of 3 patents)

14. Dominik Hartmann (2 out of 2 patents)

15. Ruedi Grueter (2 out of 2 patents)

Core Competencies:

Semiconductor Chips

Wire Bonder

Quality Checking

Chip Mounting

Bonding Parameters

Solder Dispensing

Pressure Sensor

Flexible Substrate

Electrode Formation

Liquid Delivery

Clamping Element

Linear Guide

38 patents: Sort by Forward Citations

1. 7284318 - Apparatus for mounting semiconductor chips (2007-10-23),

2. 7159751 - Wire bonder (2007-01-09),

3. 7146718 - Apparatus for mounting semiconductors (2006-12-12),

4. 7120995 - Apparatus for mounting semiconductors (2006-10-17),

5. 7108167 - Wire bonder with a device for determining the vectorial distance between the capillary and the image recognition system and method (2006-09-19),

6. 7080771 - Method for checking the quality of a wedge bond (2006-07-25),

7. 7020954 - Apparatus for placing a semiconductor chip as a flipchip on a substrate (2006-04-04),

8. 7004372 - Method for determining optimum bond parameters when bonding with a wire bonder (2006-02-28),

9. 6993986 - Clamping element with an integrated force sensor (2006-02-07),

10. 6935539 - Device for the metered delivery of a viscous liquid (2005-08-30),

11. 6931932 - Device for measuring the amplitude of the tip of an oscillating capillary (2005-08-23),

12. 6929168 - Method for determining optimum bonding parameters for bonding with a wire bonder (2005-08-16),

13. 6898481 - Apparatus for mounting semiconductor chips (2005-05-24),

14. 6857554 - Method and device for determining the vectorial distance between the capillary and the image recognition system of a wire bonder (2005-02-22),

15. 6839958 - Apparatus for mounting semiconductor chips (2005-01-11),

Company Overview

Esec, Trading Sa is a company based in Cham, Switzerland, specializing in advanced technology solutions for the semiconductor and electronics industries. The organization focuses on the development and manufacturing of innovative equipment and systems that enhance production processes and improve product quality. With a commitment to research and development, Esec plays a significant role in driving technological advancements, particularly in areas such as packaging and assembly technologies, catering to a global market.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

38 Patents

#4 in Cham

#362 in Switzerland

#17,860 in the World

Cham, Switzerland

Esec, Trading Sa

Forward Citations = 143

44 inventors:

Eugen Mannhart (5 out of 6 patents)

Michael Mayer (4 out of 4 patents)

Peter Hess (4 out of 5 patents)

4. Silvan Thuerlemann (3 out of 5 patents)

5. Nicolino Onda (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Esec, Trading Sa. Retrieved from https://idiyas.com/company/esec-trading-sa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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