Jan-Her Horng

Title: Innovations by Jan-Her Horng

Introduction

Jan-Her Horng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of bond pad protection. With a total of 2 patents, his work has been instrumental in enhancing the reliability of semiconductor devices.

Latest Patents

Jan-Her Horng's latest patents include innovative methods for protecting bond pads during the die-sawing process. One of his patents, titled "Implementation of protection layer for bond pad protection," outlines a method that involves forming a protection layer over the bond pad before die-sawing. This layer is subsequently removed by heating, ensuring the integrity of the bond pad during manufacturing. Another patent, "Stress buffered bond pad and method of making," describes a chess-board patterned bond pad structure designed to distribute bonding stresses effectively. This method significantly reduces the risk of bond pad lift-off defects, enhancing the overall performance of semiconductor devices.

Career Highlights

Jan-Her Horng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in bond pad technology has positioned him as a key contributor to the company's innovative projects. His work not only reflects his technical skills but also his commitment to advancing semiconductor manufacturing processes.

Collaborations

Jan-Her has collaborated with esteemed colleagues such as Cheng-Chung Chang and Lin-June Wu. Their combined efforts have led to advancements in semiconductor technology, showcasing the importance of teamwork in innovation.

Conclusion

Jan-Her Horng's contributions to semiconductor technology through his patents and collaborations highlight his role as a significant inventor in the field. His innovative methods for bond pad protection are paving the way for more reliable semiconductor devices.