The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2006
Filed:
Apr. 28, 2004
Applicants:
Pei-haw Tsao, Taichung, TW;
Jan-her Horng, Hsinchu, TW;
Cheng-chung Chang, Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/50 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of protecting a bond pad during die-sawing comprising the following steps. A substrate having a bond pad formed thereover is provided. A bond pad protection layer is formed over the bond pad. The substrate is die-sawed and the bond pad protection layer is removed by heating.
Tsao, Pei-Haw. (2006). Implementation of protection layer for bond pad protection (U.S. Patent No. 7105379). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7105379
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile