Beaverton, OR, United States of America

Jamie Dee Gravell

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Fei Comapny. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jamie Dee Gravell. Retrieved from https://idiyas.com/inventor/jamie-dee-gravell

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jamie Dee Gravell and TEM Lamella Support Structures

Introduction

Jamie Dee Gravell is an inventor associated with Beaverton, Oregon, and FEI Company. His patent work concerns a support structure for an inverted lamella designed to help prepare tall regions of interest for transmission electron microscopy (TEM).

Latest Patents

Gravell is associated with 1 patent, titled “Support Structure of Inverted Lamella for Tall ROI.” The invention describes lamellae with thin regions for TEM that include oppositely situated S-shaped cut faces defining a waist. In some examples, the waist is less than 25 nanometers thick and forms a double-tapered region between 400 and 800 nanometers high. A metallic or other coating at the top surface can help support the lamella.

Career Highlights

Gravell’s listed patent reflects work on structural features intended to support thin lamellae while enabling TEM examination of tall regions of interest. The patent record associates him with FEI Company.

Collaborations

Gravell’s listed coworker is Jaroslav Maniš.

Conclusion

Jamie Dee Gravell’s patent focuses on supporting an inverted lamella with a thin, tapered region suitable for TEM, highlighting his contribution to microscopy sample-preparation technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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