James Wade

Title: Innovations of James Wade in Integrated Circuit Technology

Introduction

James Wade is an accomplished inventor based in Hillsboro, OR (US). He has made significant contributions to the field of integrated circuit technology. His innovative approach has led to the development of a unique patent that enhances the performance and reliability of electronic devices.

Latest Patents

James Wade holds a patent for "Through-substrate underfill formation for an integrated circuit assembly." This patent describes a method for fabricating an integrated circuit package by disposing an underfill material between an electronic substrate and an integrated circuit device through an opening in the electronic substrate. The assembly includes an electronic substrate with a first surface and an opposing second surface, featuring at least one opening extending from the first surface to the second surface. The integrated circuit device is electrically attached to the electronic substrate with at least one interconnect, and the underfill material is strategically placed to enhance the connection.

Career Highlights

James Wade is currently employed at Intel Corporation, where he continues to push the boundaries of technology. His work focuses on improving the efficiency and effectiveness of integrated circuit assemblies. With a patent portfolio that includes 1 patent, he has established himself as a key player in the industry.

Collaborations

James has collaborated with notable colleagues such as Eng Huat Goh and Kyle Davidson. Their combined expertise has contributed to advancements in integrated circuit technology.

Conclusion

James Wade's innovative contributions to integrated circuit technology exemplify the impact of dedicated inventors in the tech industry. His patent for through-substrate underfill formation showcases his commitment to enhancing electronic device performance.