James George Lance, Jr

Title: James George Lance, Jr.: Semiconductor Packaging Inventor

Introduction

James George Lance, Jr. is an inventor associated with Lake Worth, Florida. His patent work includes techniques for improving flip-chip packaging, particularly solder-bump fabrication and underfill application. He is associated with Motorola Corporation and is credited with 3 patents.

Latest Patents

Lance’s listed patents address two stages of flip-chip assembly.

“Process for Fabricating a Solder Bump for a Flip Chip Integrated Circuit” describes forming a solder bump from two evaporatively deposited metallization systems. The first forms an elongated post that extends beyond the die-pad window over the passivation layer, while the second forms a cap. When reflowed, the materials combine to create a eutectic solder bump with an improved geometry.

“Flip Underfill Injection Technique” presents a method for dispensing underfill between a flip chip and its substrate. A port is drilled through the substrate before reflow, allowing a pressurized pump to inject a measured amount of underfill after reflow. The material then spreads by capillary action and helps displace air around the joints.

Career Highlights

Lance’s documented inventions focus on practical manufacturing methods for semiconductor devices. His work addresses solder-bump formation and the controlled delivery of underfill, both important to assembling and supporting flip-chip connections. His association with Motorola Corporation places these contributions within the company’s semiconductor technology work.

Collaborations

Robert Kenneth Doot and Jonathon G. Greenwood are identified as Lance’s coworkers. The available information does not specify their roles in the patents or whether they collaborated with him on particular inventions.

Conclusion

James George Lance, Jr.’s patent record highlights manufacturing innovations for flip-chip integrated circuits, including improved solder-bump geometry and a pressure-assisted underfill process.