The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 1997
Filed:
Aug. 22, 1995
James George Lance, Jr, Lake Worth, FL (US);
Robert Kenneth Doot, Boynton Beach, FL (US);
Karl Marcus Wahlfrid, Delray Beach, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method for dispensing underfill material between a flip chip bonded to substrate. The method requires an underfill injection port to be drilled through the substrate prior to reflow such that underfill material can be dispensed between the flip chip and substrate through the port. After reflow is completed, a pressurized pump delivers a predetermined amount of underfill under hydraulic pressure through the underfill injection port between the flip chip and substrate. Once injected, the underfill migrates between the flip chip and substrate via capillary action pushing out any air around the joints.