James A Jones

Title: Innovations of James A. Jones

Introduction

James A. Jones is a notable inventor based in Redwood City, CA. He holds 4 patents that showcase his contributions to the field of semiconductor technology. His work has significantly impacted the efficiency and performance of electronic packages.

Latest Patents

One of his latest patents is titled "Metallic thermal joint for high power density chips." This invention describes a method for assembling a semiconductor package that involves cleaning the surfaces of a chip and a heat removal device through reverse sputtering. The process includes sequentially coating these surfaces with an adhesive layer, a barrier layer, and a protective layer over a target joining area. The chip and heat removal device are then preheated and joined using a metallic thermal interface material (TIM) preform in a fluxless process. The method concludes with heating the joined fixtures in a reflow oven.

Another significant patent is "Method and apparatus for force transfer via bare die package." This invention outlines a method and apparatus that enhance the uniformity and diffusion of force transfer on a bare die electronic package. By applying additional force absorbent material around the bare die, the force can be distributed more evenly, resulting in a robust electronic package.

Career Highlights

James A. Jones has worked with prominent companies such as Sun Microsystems, Inc. and Oracle America, Inc. His experience in these organizations has contributed to his expertise in semiconductor technology and electronic packaging.

Collaborations

Throughout his career, James has collaborated with notable colleagues, including Vadim Gektin and Vernon P. Bollesen. These collaborations have further enriched his work and innovations in the field.

Conclusion

James A. Jones is a distinguished inventor whose patents reflect his innovative spirit and technical expertise. His contributions to semiconductor technology continue to influence the industry positively.