Sun Microsystems, Inc.

Oracle America, Inc.

James A Jones

Vadim Gektin

Vernon P Bollesen

Ron Zhang

Margaret B Stern

Mary Jane Krebser

Seshasayee Ankireddi

Jeffrey Kaskey

A method for the assembly of a semiconductor package that includes cleaning a surface of a chip and a surface of a heat removal device by reverse sputtering is given. The method includes sequentially coating the surface of the chip and the surface of the heat removal device with an adhesive layer, a barrier layer, and a protective layer over a target joining area. The chip and the heat removal device are placed into carrier fixtures and preheated to a target temperature. Then a metallic thermal interface material (TIM) preform is mechanically rolled onto the surface of the chip and the first and the second carrier fixtures are attached together such that the metallic TIM layer on the surface of the chip is joined to the coated surface of the heat removal device through a fluxless process. The method includes heating the joined carrier fixtures in a reflow oven.

Metallic thermal joint for high power density chips

The present application describes a method and an apparatus for facilitating increased uniformity and diffusion of force transfer on a bare die electronic package for example, when such electronic package is attached to a circuit board. Additional force absorbent material is applied around a bare die in the bare die electronic package. The force applied to the bare die electronic package can be distributed to the additional force absorbent material. A curable force absorbent material is dispensed around the bare die in the bare die electronic package. The surface of the curable material is substantially parallel with the surface of bare die thus facilitating a substantially uniform force distribution through the bare die and curable material resulting in a robust bare die electronic package.

Method and apparatus for force transfer via bare die package

A heat sink assembly includes a heat sink, a circuit board and an integrated circuit package. The package is located between the heat sink and the circuit board and attached to a die attach area of the circuit board. A heat sink retainer attached to the heat sink has a base section located adjacent to the circuit board directly opposite the die attach area. The retainer presses the heat sink down uniformly on the package. Further, the downward force applied to the heat sink is countered by an equal upward force applied by the base section of the retainer on the circuit board. Since the base section is located directly opposite the die attach area, the upward force is transferred from the base section directly back to the heat sink without imparting any bending force on the circuit board.

SRAM heat sink assembly and method of assembling

An extraction tool for extracting a module that is detachably connected to a mounting substrate includes a fixed plate that is vertically supported over the module to be extracted. A movable plate is arranged below the fixed plate and a screw is inserted in central openings in each of the fixed and movable plates. A pair of vertically extending side panels are connected at one edge by a hinge to opposite sides of the movable plate. The opposite edge of the respective side panels are used to grip the module to be extracted. A spring biases the side panels inwardly. A rotatable handle is arranged above the fixed plate and is connected to the screw. Lateral rotation of the handle causes a corresponding axial rotation of the screw for moving the movable plate in a vertical direction. The precise vertical movement of the plate also causes vertical movement of the side panels gripping the module which ensures that the module is extracted without any side-to-side or twisting motion, thereby avoiding damage to the connectors.

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Redwood City, CA, United States of America

James A Jones