The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2013
Filed:
Dec. 17, 2010
Seshasayee Ankireddi, Redwood City, CA (US);
Vadim Gektin, Redwood City, CA (US);
James A. Jones, Redwood City, CA (US);
Margaret B. Stern, Redwood City, CA (US);
Seshasayee Ankireddi, Redwood City, CA (US);
Vadim Gektin, Redwood City, CA (US);
James A. Jones, Redwood City, CA (US);
Margaret B. Stern, Redwood City, CA (US);
Oracle America, Inc., Redwood City, CA (US);
Abstract
A method for the assembly of a semiconductor package that includes cleaning a surface of a chip and a surface of a heat removal device by reverse sputtering is given. The method includes sequentially coating the surface of the chip and the surface of the heat removal device with an adhesive layer, a barrier layer, and a protective layer over a target joining area. The chip and the heat removal device are placed into carrier fixtures and preheated to a target temperature. Then a metallic thermal interface material (TIM) preform is mechanically rolled onto the surface of the chip and the first and the second carrier fixtures are attached together such that the metallic TIM layer on the surface of the chip is joined to the coated surface of the heat removal device through a fluxless process. The method includes heating the joined carrier fixtures in a reflow oven.