Company Filing History:
Years Active: 2013
Title: Seshasayee Ankireddi: Innovator in Semiconductor Technology
Introduction
Seshasayee Ankireddi is a notable inventor based in Redwood City, CA (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of thermal management for high power density chips. His innovative approach has led to the development of a unique method that enhances the efficiency and reliability of semiconductor packages.
Latest Patents
Ankireddi holds a patent for a "Metallic thermal joint for high power density chips." This patent describes a method for assembling a semiconductor package that involves cleaning the surfaces of both the chip and the heat removal device through reverse sputtering. The process includes sequentially applying an adhesive layer, a barrier layer, and a protective layer over the target joining area. The chip and heat removal device are then preheated and joined using a metallic thermal interface material (TIM) preform, ensuring a fluxless process. The final step involves heating the joined components in a reflow oven, which solidifies the connection.
Career Highlights
Seshasayee Ankireddi is currently employed at Oracle America, Inc., where he continues to work on advancing semiconductor technologies. His expertise in thermal management has positioned him as a valuable asset in the field, contributing to the development of innovative solutions that address the challenges of high power density applications.
Collaborations
Ankireddi has collaborated with notable colleagues such as Vadim Gektin and James A Jones. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Seshasayee Ankireddi's contributions to semiconductor technology, particularly through his patented methods, highlight his role as an innovator in the field. His work at Oracle America, Inc. and collaborations with esteemed colleagues further emphasize his commitment to advancing technology in high power density applications.