Simpsonville, SC, United States of America

James A Burk


Average Co-Inventor Count = 3.8

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2019-2023

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Innovations of James A Burk

Introduction

James A Burk is a notable inventor based in Simpsonville, SC (US). He has made significant contributions to the field of electronics, particularly in the development of high-density multi-component packages. With a total of 3 patents to his name, Burk's work has had a substantial impact on the industry.

Latest Patents

Burk's latest patents include innovative designs for component assemblies and embedding for high-density electronics. This patent describes a high-density multi-component package that features a first module interconnect pad and a second module interconnect pad. It allows for the mounting of at least two electronic components between these pads, with one component oriented vertically relative to each pad. Another significant patent focuses on higher density multi-component and serial packages. This design includes at least two electronic components, each with external terminations, and utilizes adhesives to connect the components serially, enhancing the overall functionality and efficiency of electronic assemblies.

Career Highlights

James A Burk is currently employed at Kemet Electronics Corporation, where he continues to innovate and develop new technologies. His expertise in high-density electronics has positioned him as a valuable asset to the company and the industry at large.

Collaborations

Throughout his career, Burk has collaborated with talented individuals such as John Bultitude and Galen W Miller. These partnerships have fostered a creative environment that has led to the successful development of various electronic innovations.

Conclusion

James A Burk's contributions to the field of electronics through his patents and collaborations highlight his role as a leading inventor. His work continues to influence the design and functionality of high-density electronic components.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…