Kemet Electronics Corporation

James A Burk

John Bultitude

Galen W Miller

Lonnie G Jones

Mark R Laps

Allen Templeton

Hunter Hayes

Peter Alexandre Blais

Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

Component assemblies and embedding for high density electronics

A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.

Higher density multi-component and serial packages

Growing community of inventors

Simpsonville, SC, United States of America

James A Burk