The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Jan. 13, 2021
Kemet Electronics Corporation, Fort Lauderdale, FL (US);
John Bultitude, Simpsonville, SC (US);
Peter Alexandre Blais, Milpitas, CA (US);
James A. Burk, Simpsonville, SC (US);
Galen W. Miller, Simpsonville, SC (US);
Hunter Hayes, Simpsonville, SC (US);
Allen Templeton, Simpsonville, SC (US);
Lonnie G. Jones, Simpsonville, SC (US);
Mark R. Laps, Simpsonville, SC (US);
KEMET Electronics Corporation, Fort Lauderdale, FL (US);
Abstract
Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.