Cheonan-si, South Korea

Jaeyong Park

USPTO Granted Patents = 6 

Average Co-Inventor Count = 4.3

ph-index = 1

Forward Citations = 40(Granted Patents)


Company Filing History:


Years Active: 2015-2025

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6 patents (USPTO):Explore Patents

Title: Jaeyong Park: Innovator in Semiconductor Technology

Introduction

Jaeyong Park is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on innovative methods and devices that enhance the efficiency and effectiveness of semiconductor fabrication processes.

Latest Patents

Jaeyong Park's latest patents include an inspection method, a substrate processing method, and a substrate processing device utilizing the substrate processing method. The inspection method involves extracting a first similarity by comparing first data of a first optical signal with reference data of a reference optical signal. It generates a first normal distribution of the first similarity and compares it with a second normal distribution derived from a second optical signal. Additionally, he has developed a method for fabricating a semiconductor device using an adhesive layer, which involves placing an adhesive layer on a semiconductor substrate and separating a carrier substrate while maintaining the adhesive layer's attachment.

Career Highlights

Jaeyong Park is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics and semiconductor industry. His innovative approaches have contributed to advancements in semiconductor technology, making him a valuable asset to his organization.

Collaborations

Some of his notable coworkers include Junyoung Ko and Whasu Sin, who collaborate with him on various projects within the semiconductor field.

Conclusion

Jaeyong Park's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His advancements continue to shape the future of semiconductor fabrication processes.

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