Samsung Electronics Co., Ltd.

Jaeyong Park

Junyoung Ko

Whasu Sin

Kyhyun Jung

Sungil Cho

Youngmin Kim

Younghoon Kim

Myunggeun Song

Kunho Song

Jun-su Lim

Taeil Cho

Kyung-Hak Lee

Byung-Joo Jo

Sarah Kim

Changyul Kim

An inspection method includes extracting a first similarity by comparing first data of a first optical signal with reference data of a reference optical signal, generating a first normal distribution of the first similarity, extracting a second similarity by comparing second data of a second optical signal with the reference data of the reference optical signal, generating a second normal distribution of the second similarity, and comparing the first normal distribution with the second normal distribution. The extracting of the first similarity includes deriving the first data of the first optical signal.

Inspection method, substrate processing method including the same, and substrate processing device using the substrate processing method

A method of fabricating a semiconductor device is provided in which an adhesive layer is disposed on a first surface of a first semiconductor substrate. A carrier substrate is provided on the first surface of the first semiconductor substrate, and the carrier substrate is separated from a surface of the adhesive layer while the adhesive layer is still attached to the first surface of the first semiconductor substrate.

Method of fabricating a semiconductor device using an adhesive layer

A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

Removal apparatuses for semiconductor chips

A tape film lamination apparatus may include a housing, a substrate holder disposed in the housing and positioned to receive a substrate, a film holder disposed on the housing and positioned to support a tape film, and an air removal unit connected to a portion of the housing below the film holder to remove and/or exhaust air from the housing resulting to attach the tape film to the substrate.

Apparatus for laminating a tape film on a substrate and a system of fabricating a semiconductor device using the same

An apparatus for removing a semiconductor chip from a board may include: a laser configured to irradiate the board with a laser beam to heat bumps mounting the semiconductor chip on the board; a picker configured to separate the semiconductor chip from the board; a vacuum portion configured to provide a vacuum to the picker; and an intake. If solder pillars, that are residues of the bumps, are melted by the laser beam, the intake removes the solder pillars using the vacuum provided from the vacuum portion. An apparatus for removing a semiconductor chip from a board may include: a stage configured to support the board on which the semiconductor chip is mounted by bumps; a laser configured to irradiate the board with a laser beam to heat the bumps mounting the semiconductor chip on the board; and a picker configured to separate the semiconductor chip from the board.

Growing community of inventors

Cheonan-si, South Korea

Jaeyong Park