The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Oct. 18, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Kyung-Hak Lee, Yongin-si, KR;
Jaeyong Park, Cheonan-si, KR;
Jun-su Lim, Hwaseong-si, KR;
Sungil Cho, Asan-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO, LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/463 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/463 (2013.01); H01L 21/486 (2013.01); H01L 21/52 (2013.01); H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 23/481 (2013.01); H01L 23/5386 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01);
Abstract
A method of fabricating a semiconductor device is provided in which an adhesive layer is disposed on a first surface of a first semiconductor substrate. A carrier substrate is provided on the first surface of the first semiconductor substrate, and the carrier substrate is separated from a surface of the adhesive layer while the adhesive layer is still attached to the first surface of the first semiconductor substrate.