Jae-Sik Chung

Title: Innovations of Jae-Sik Chung in Chipstack Technology

Introduction

Jae-Sik Chung is a prominent inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative methods for manufacturing chip stack packages. With a total of six patents to his name, Chung's work has had a substantial impact on the electronics industry.

Latest Patents

One of Jae-Sik Chung's latest patents is titled "Chipstack package and manufacturing method thereof." This patent outlines a comprehensive method for manufacturing chip stack packages. The process includes providing at least two wafers, each containing multiple chips, and forming scribe lanes that separate adjacent chips. It involves creating via holes in the scribe lanes, establishing electrical connections, and thinning the wafers. The method culminates in the encapsulation and separation of individual chip stack packages, showcasing Chung's innovative approach to enhancing semiconductor technology.

Career Highlights

Jae-Sik Chung is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to advancements in semiconductor packaging. His expertise and innovative mindset have positioned him as a key player in the industry.

Collaborations

Chung has collaborated with notable colleagues, including Dong-Hyeon Jang and Kang-Wook Lee. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies in the field of electronics.

Conclusion

Jae-Sik Chung's contributions to the semiconductor industry, particularly through his innovative chip stack packaging methods, highlight his role as a leading inventor. His work continues to influence advancements in technology, making a lasting impact on the field.