Jacob R Mauermann

This inventor holds 7 USPTO granted patents and 9 published patent applications. Top assignees: Rockwell Collins, Inc., Bae Systems Information and Electronic Systems Integration Inc.. Active years: 2022-2026.

USPTO Granted Patents = 7 (Patent Applications = 9)

% Patents Active = 85.7

Average Co-Inventor Count = 4.8

ph-index = 1

Company Filing History:

6 out of 3,018

Rockwell Collins, Inc.

patents

1 out of 1,862

Bae Systems Information and Electronic Systems Integration Inc.

patents

Years Active: 2022-2026

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7 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12622266 - Die level cavity heat sink (2026-05-05),

2. 11948855 - Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader (2024-04-02),

3. 11605570 - Reconstituted wafer including integrated circuit die mechanically interlocked with mold material (2023-03-14),

4. 11515225 - Reconstituted wafer including mold material with recessed conductive feature (2022-11-29),

5. 11326246 - Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film deposition (2022-05-10),

6. 11239182 - Controlled induced warping of electronic substrates (2022-02-01),

7. 11236436 - Controlled induced warping of electronic substrates via electroplating (2022-02-01),

Title: Inventor Spotlight: Jacob R. Mauermann

Introduction

Jacob R. Mauermann, an innovative inventor based in Marion, IA, has made significant contributions to the field of integrated circuit packaging. With a total of six patents to his name, Mauermann has focused on enhancing the efficiency and functionality of semiconductor technologies.

Latest Patents

Mauermann's most recent patents illustrate his commitment to innovation in integrated circuit (IC) technologies. One notable patent is for an IC package that incorporates a cantilever multi-chip module (MCM) heat spreader. This sophisticated design comprises a substrate with a dual-layered structure, featuring a thermal coupling system that maximizes heat dissipation from the semiconducting die, ensuring optimal performance.

Another significant patent is for a reconstituted wafer that includes IC die mechanically interlocked with mold material. This system not only provides a protective housing for the IC die but also enhances the structural integrity through interlocking, thus improving the overall reliability of the electronic components.

Career Highlights

Jacob R. Mauermann is currently associated with Rockwell Collins, Inc., a leader in aviation electronics and technology solutions. His work at the company emphasizes his role in developing cutting-edge solutions that are essential for modern electronic systems and applications.

Collaborations

Throughout his career, Mauermann has collaborated with esteemed colleagues such as Richard Korneisel and Nathaniel P. Wyckoff. These partnerships have fostered a collaborative environment that enhances creativity and drives innovation within their projects.

Conclusion

Jacob R. Mauermann continues to be a prolific inventor whose work in integrated circuit packaging is paving the way for advancements in semiconductor technologies. His contributions, through innovative patents and collaborative efforts, serve as a testament to his commitment to pushing the boundaries of technology.