The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Sep. 10, 2020
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Richard Korneisel, Cedar Rapids, IA (US);
Nathaniel P. Wyckoff, Marion, IA (US);
Brandon C. Hamilton, Marion, IA (US);
Jacob R. Mauermann, Marion, IA (US);
Carlen R. Welty, Solon, IA (US);
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Abstract
An integrated circuit (IC) package incorporating controlled induced warping is disclosed. The IC package includes an electronic substrate having an active side upon which semiconducting dies and functional circuits have been lithographed or otherwise fabricated, leading to an inherent warping in the direction of the active side. One or more corrective layers may be deposited to the opposing, or inactive, side of the semiconducting die via electroplating in order to induce corrective warping of the electronic substrate back toward the horizontal (e.g., in the direction of the inactive side) to a desired degree.