Rockwell Collins, Inc.

Jacob R Mauermann

Nathaniel P Wyckoff

Richard Korneisel

Brandon C Hamilton

Bret W Simon

Carlen R Welty

Mark T Dimke

Kaitlyn M Fisher

An integrated circuit (IC) package comprises a substrate having an outer portion close to the perimeter of the substrate, an inner portion surrounded by the outer portion, and an upper surface incorporating a wiring layer for the bonding of a semiconducting die (e.g., via its bottom face). The IC package includes a metallic or otherwise thermally conductive heat spreader thermally bonded on an inner surface of a boss on its bottom side to the top surface of the semiconducting die, and extending on its top surface to the edges of the substrate to maximize heat dissipation from the die. The boss extends toward the semiconducting die and is thermally coupled to the top face of the semiconducting die.

Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader

A system and method. The system may include an integrated circuit (IC) die. The IC die may have two faces and sides. The system may further include mold material. The mold material may surround at least the sides of the IC die. The IC die may be mechanically interlocked with the mold material.

Reconstituted wafer including integrated circuit die mechanically interlocked with mold material

A system and method. The system may include an integrated circuit (IC) die having two faces and sides. The system may further include mold material surrounding at least the sides of the IC die. The system may further include a redistribution layer and signal pads. The redistribution layer may be positioned between (a) the signal pads and (b) the mold material and the IC die. The redistribution layer may have conductive paths at least connecting the IC die and at least some of the signal pads. A surface of the mold material may abut the redistribution layer. The surface of the mold material may include at least one recessed area having at least one conductive feature connected to at least one of the conductive paths or the IC die.

Reconstituted wafer including mold material with recessed conductive feature

A system and method includes pre-warping a mask to induce strain when affixed to a substrate and ensure positive contact between the mask and the substrate during all phases of deposition. A film is applied to the mask at a rate sufficient to impart stress to the film faster than such stress can be released. Depending on the features defined by the mask, the pre-warping may be concentric, linear along one axis, or complex along a plurality of axes.

Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film deposition

An integrated circuit (IC) package incorporating controlled induced warping is disclosed. The IC package includes an electronic substrate having an active side upon which semiconducting dies and functional circuits have been lithographed or otherwise fabricated, leading to an inherent warping in the direction of the active side. One or more corrective layers may be deposited to the opposing, or inactive, side of the semiconducting die via thin film deposition (TFD) instrumentation and techniques in order to induce corrective warping of the electronic substrate back toward the horizontal (e.g., in the direction of the inactive side) to a desired degree.

Controlled induced warping of electronic substrates

An integrated circuit (IC) package incorporating controlled induced warping is disclosed. The IC package includes an electronic substrate having an active side upon which semiconducting dies and functional circuits have been lithographed or otherwise fabricated, leading to an inherent warping in the direction of the active side. One or more corrective layers may be deposited to the opposing, or inactive, side of the semiconducting die via electroplating in order to induce corrective warping of the electronic substrate back toward the horizontal (e.g., in the direction of the inactive side) to a desired degree.

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Marion, IA, United States of America

Jacob R Mauermann