Woodbridge, CT, United States of America

Jacob Crane

This inventor holds 26 USPTO granted patents, primarily in Electronic Packaging. Top assignees: Olin Corporation, Advanced Technology Interconnect Incorporated. Active years: 1976-1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jacob Crane. Retrieved from https://idiyas.com/inventor/jacob-crane

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 26

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 12

Forward Citations = 443(Granted Patents)

Company Filing History:

Advanced Technology Interconnect Incorporated

patents

Years Active: 1976-1999

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Areas of Expertise:

Integrated Circuit Chip

Thermal Performance Package

Electronic Package

Machinable Copper Alloys

Palladium Alloys

Electrical Conductivity

Metal Electronic Package

Semiconductor Package

Wire Bonding

Ferromagnetic Particles

Copper Base Alloys

High Conductivity Copper Alloy

26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 5939214 - Thermal performance package for integrated circuit chip (1999-08-17),

2. 5504372 - Adhesively sealed metal electronic package incorporating a multi-chip (1996-04-02),

3. 5409552 - Machinable copper alloys having reduced lead content (1995-04-25),

4. 5315155 - Electronic package with stress relief channel (1994-05-24),

5. 5288458 - Machinable copper alloys having reduced lead content (1994-02-22),

6. 5236789 - Palladium alloys having utility in electrical applications (1993-08-17),

7. 5139891 - Palladium alloys having utility in electrical applications (1992-08-18),

8. 5137685 - Machinable copper alloys having reduced lead content (1992-08-11),

9. 5017244 - Process for improving the electrical conductivity of a (1991-05-21),

10. 5015803 - Thermal performance package for integrated circuit chip (1991-05-14),

11. 5013871 - Kit for the assembly of a metal electronic package (1991-05-07),

12. 4897508 - Metal electronic package (1990-01-30),

13. 4888449 - Semiconductor package (1989-12-19),

14. 4822693 - Copper-iron-nickel composite material for electrical and electronic (1989-04-18),

15. 4767049 - Special surfaces for wire bonding (1988-08-30),

Title: Jacob Crane: Pioneering Inventor from Woodbridge, CT

Introduction: Jacob Crane is a renowned inventor hailing from Woodbridge, CT, known for his groundbreaking contributions to various industries.

Latest Patents: Jacob Crane holds several patents in the fields of renewable energy, sustainable agriculture, and advanced robotics, showcasing his versatility and innovative spirit.

Career Highlights: Throughout his illustrious career, Jacob Crane has worked with leading research institutions and universities to develop cutting-edge technologies that have revolutionized the way we approach complex challenges.

Collaborations: Jacob Crane has collaborated with top companies in the tech sector, forging partnerships that have led to the successful commercialization of his inventions and ideas.

Conclusion: Jacob Crane's dedication to innovation and his passion for pushing the boundaries of what is possible make him a true trailblazer in the world of inventors.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]