The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 1996

Filed:

Dec. 12, 1994
Applicant:
Inventors:

Jeffrey S Braden, Livermore, CA (US);

Jacob Crane, Woodbridge, CT (US);

Deepak Mahulikar, Madison, CT (US);

Assignee:

Olin Corporation, Manteca, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257723 ; 257706 ; 257724 ;
Abstract

There is provided a leadframe assembly for supporting a hybrid circuit. The hybrid circuit is supported by either the base of an electronic package or by a die attach paddle and electrically interconnected to a leadframe by wire bonds. A plurality of semiconductor devices are mounted on the assembly and supported by either metallization pads formed on the hybrid circuit, a dielectric layer of the hybrid circuit, a die attach paddle, a metallic package component or combinations thereof.


Find Patent Forward Citations

Braden, Jeffrey. (1996). Adhesively sealed metal electronic package incorporating a multi-chip (U.S. Patent No. 5504372). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5504372

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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