Philadelphia, PA, United States of America

Jack V Ajoian

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Lockheed Martin Corporation. Active years: 2012-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jack V Ajoian. Retrieved from https://idiyas.com/inventor/jack-v-ajoian

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 3 

% Patents Active = 66.7

Average Co-Inventor Count = 1.7

ph-index = 2

Forward Citations = 12(Granted Patents)


Location History:

  • Philadephia, PA (US) (2012)
  • Philadelphia, PA (US) (2017 - 2018)

Company Filing History:


Years Active: 2012-2018

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3 patents (USPTO):Explore Patents

Title: Jack V Ajoian: Innovator in Printed Circuit Board Technology

Introduction

Jack V Ajoian is a notable inventor based in Philadelphia, PA (US). He has made significant contributions to the field of printed circuit board technology, holding a total of 3 patents. His work focuses on improving the functionality and reliability of electronic components.

Latest Patents

One of Jack's latest patents is titled "System and method for improving isolation in high-density laminated printed circuit boards." This invention involves a system and method for isolating a layer-to-layer transition between conductors in a multilayer printed circuit board. It includes the formation of a first ground via that at least partially surrounds a first signal conductor in one layer of the printed circuit board, as well as a second ground via that surrounds a second signal conductor in another layer. Both ground vias are plated with a conductive material to enhance performance.

Another significant patent is "Interconnect structure configured to control solder flow and method of manufacturing of same." This invention describes an interconnect structure that includes a substrate and a copper trace line defined on the surface of the substrate. The copper trace line features a transmission line and a contact pad, which are plated with a layer of metal that oxidizes when exposed to the atmosphere. A layer of gold is selectively applied to the transmission line and contact pad, creating a gap that defines a barrier to solder spread.

Career Highlights

Jack V Ajoian is currently employed at Lockheed Martin Corporation, where he continues to innovate in the field of electronic engineering. His expertise in printed circuit board technology has made him a valuable asset to the company.

Collaborations

Throughout his career, Jack has collaborated with several talented individuals, including Thomas V Benevides and Daniel H McCauley, IV. These collaborations have contributed to the advancement of technology in their respective fields.

Conclusion

Jack V Ajoian is a distinguished inventor whose work in printed circuit board technology has led to multiple patents and significant advancements in the industry. His contributions continue to shape the future of electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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