Lockheed Martin Corporation

Jack V Ajoian

Richard Johann Heinrich

Daniel H McCauley, Iv

Daniel L Blass

Thomas V Benevides

A system and method of isolating a layer-to-layer transition between conductors in a multilayer printed circuit board includes formation of a first ground via at least partially surrounding a first signal conductor in at least one layer of the printed circuit board and formation of a second ground via at least partially surrounding a second signal conductor in another layer of the printed circuit board. The first and second ground vias are plated with a conductive material.

System and method for improving isolation in high-density laminated printed circuit boards

An interconnect structure and method for manufacturing the same includes a substrate and a copper trace line defined on a surface of the substrate. The copper trace line includes a transmission line and a contact pad. The copper trace line is plated with a layer of metal which will oxidize if exposed to the atmosphere. The layer of metal is further plated with a layer of gold. The gold layer is selectively applied to the transmission line and the contact pad to define a gap on the transmission line at the contact pad. The metal layer is exposed in the gap. An oxide layer is formed on the metal layer in the gap. The oxide layer and the substrate surround the contact pad define a barrier to spread of solder.

Interconnect structure configured to control solder flow and method of manufacturing of same

A transformer includes a magnetic core through which an insulated electrical first conductor extends to define a turn of winding. The first conductor is tubular, in that it defines a generally axial aperture. A plurality of electrically insulated conductive windings are twisted together to form a bundle, or a pair if only two. The bundle extends through the axial aperture, to define at least an additional turn of winding. The individual conductors of the bundle are stripped of insulation at locations without the aperture of the first conductor.

Growing community of inventors

Philadelphia, PA, United States of America

Jack V Ajoian