The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Dec. 17, 2012
Applicant:
Lockheed Martin Corporation, Bethesda, MD (US);
Inventor:
Jack V. Ajoian, Philadelphia, PA (US);
Assignee:
Lockheed Martin Corporation, Bethesda, MD (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 3/34 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/112 (2013.01); H05K 3/429 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H05K 1/111 (2013.01); H05K 3/3452 (2013.01); H05K 3/4602 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/096 (2013.01);
Abstract
A system and method of isolating a layer-to-layer transition between conductors in a multilayer printed circuit board includes formation of a first ground via at least partially surrounding a first signal conductor in at least one layer of the printed circuit board and formation of a second ground via at least partially surrounding a second signal conductor in another layer of the printed circuit board. The first and second ground vias are plated with a conductive material.