Jack Cheng

Title: Jack Cheng: Innovator in Reliable Interconnection Technology

Introduction

Jack Cheng is a prominent inventor based in Nanjing, China. He has made significant contributions to the field of interconnect technology, particularly through his innovative patent. With a focus on reliability and efficiency, Cheng's work has the potential to impact various applications in the semiconductor industry.

Latest Patents

Jack Cheng holds a patent for a method that enhances the reliability of interconnects. This patent, titled "Reliable Interconnection," describes a device layer that serves multiple purposes, including acting as a barrier or an etch stop layer. Notably, the device layer is UV resistant, ensuring that its dielectric constant and stress remain stable when subjected to UV curing. This innovation is crucial for advancing the performance and durability of electronic devices.

Career Highlights

Cheng is currently employed at Globalfoundries Singapore Pte. Ltd., where he continues to develop cutting-edge technologies. His work at this leading semiconductor manufacturer allows him to collaborate with other talented professionals in the industry. Cheng's dedication to innovation has positioned him as a key player in the field of interconnect technology.

Collaborations

Throughout his career, Jack Cheng has worked alongside notable colleagues, including Huang Liu and Wei Lu. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Jack Cheng's contributions to reliable interconnection technology exemplify the spirit of innovation in the semiconductor industry. His patent and ongoing work at Globalfoundries Singapore Pte. Ltd. highlight his commitment to advancing technology for the future.