The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2011
Filed:
May. 27, 2009
Applicants:
Huang Liu, Singapore, SG;
Jack Cheng, Nanjing, CN;
Wei LU, Singapore, SG;
Yihua Wang, Singapore, SG;
Meisheng Zhou, Singapore, SG;
Inventors:
Huang Liu, Singapore, SG;
Jack Cheng, Nanjing, CN;
Wei Lu, Singapore, SG;
Yihua Wang, Singapore, SG;
Meisheng Zhou, Singapore, SG;
Assignee:
GlobalFoundries Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Embodiments relate to a method for forming reliable interconnects by the use of a device layer that can serve as a barrier or an etch stop layer, among other applications. The device layer is UV resistant in that its dielectric constant and stress remain stable or relatively stable when subjected to UV curing.