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For the Inventor, By the Inventor

Busan, South Korea

Ja Eun Yun

This inventor holds 3 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2010-2015.

USPTO Granted Patents = 3

% Patents Active = 100.0

Average Co-Inventor Count = 2.9

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:

goldMedal3 out of 1,842 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2010-2015

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3 patents (USPTO):Explore Patents
1. 8956914 - Integrated circuit package system with overhang die (2015-02-17),
2. 8067275 - Integrated circuit package system with package integration (2011-11-29),
3. 7656017 - Integrated circuit package system with thermo-mechanical interlocking substrates (2010-02-02),
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