Stats Chippac Pte. Ltd.

Ja Eun Yun

Jong Wook Ju

Taeg Ki Lim

WonJun Ko

SeungYong Chai

Hyun Joung Kim

An integrated circuit package system comprising: forming a substrate having a solder mask with a support structure formed from the solder mask; mounting a first integrated circuit device over the support structure; connecting the substrate and the first integrated circuit device; and encapsulating the first integrated circuit device and the support structure.

Integrated circuit package system with overhang die

An integrated circuit package system comprising: providing a base substrate; attaching a base integrated circuit die over the base substrate; forming a support over the base substrate near only one edge of the base substrate; and attaching a stack substrate over the support and the base integrated circuit die.

Integrated circuit package system with package integration

An integrated circuit package system includes providing a plurality of substrates; inserting a receptor in one of the substrates, the receptor held in and not extending through the one of the substrates; inserting a conductive post in another of the substrates; mounting the one of the substrates and the another of the substrates over one another with the conductive post engaging the receptor to thermally interlock without a separate bonding material; and mounting an integrated circuit mounted on the one of the substrates or the another of the substrates.

Growing community of inventors

Busan, South Korea

Ja Eun Yun