This inventor holds 3 USPTO granted patents. Top assignee: Intel Corporation. Active years: 1995-1997.
Company Filing History:
Years Active: 1995-1997
Title: J D Wilson: Innovator in Integrated Circuit Packaging
Introduction
J D Wilson is a notable inventor based in Phoenix, AZ, who has made significant contributions to the field of integrated circuit packaging. With a total of 3 patents to his name, Wilson has developed innovative solutions that enhance the functionality and efficiency of semiconductor devices.
Latest Patents
One of Wilson's latest patents is the TCP TAB design with radial outer leads. This invention features an integrated circuit package that includes a plurality of inner surface pads arranged in an angular pattern around the integrated circuit. The inner surface pads are connected to the outer surface pads of the integrated circuit using a TAB tape, which contains multiple conductors. Each conductor has one end attached to the outer pads of the integrated circuit and a land portion connected to the inner surface pads of the substrate. The land portions are also arranged in an angular pattern, optimizing the design for performance.
Another significant patent by Wilson is the staggered land pad pattern on substrate for tab interconnection. This patent describes a packaging method for a semiconductor device that utilizes tape-automated bonding (TAB) to connect an integrated circuit chip to a package substrate. The land pads on the substrate are staggered in two rows, with adjacent pads alternating, resulting in a smaller effective overall pitch than that of each row. This innovative approach improves the efficiency of the packaging process.
Career Highlights
J D Wilson is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to contribute to cutting-edge technologies and collaborate with other talented professionals in the field.
Collaborations
Throughout his career, Wilson has worked alongside notable colleagues such as Altaf Hasan and Bidyut K Bhattacharyya. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies in integrated circuit packaging.
Conclusion
J D Wilson's contributions to the field of integrated circuit packaging through his patents and work at Intel Corporation highlight his role as an influential inventor. His innovative designs continue to shape the future of semiconductor technology.