The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 1997
Filed:
Dec. 29, 1994
Applicant:
Inventors:
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01R / ;
U.S. Cl.
CPC ...
174 524 ; 361772 ; 361774 ; 361777 ; 361813 ; 257668 ;
Abstract
A package for a semiconductor device. The device is packaged using tape-automated bonding (TAB) to bond an integrated circuit chip to a package substrate of any type. The land pads on the substrate are staggered such that they are arranged in two rows with adjacent pads alternating. In this way, the effective overall pitch of the land pads is smaller than that of each row.