This inventor holds 3 USPTO granted patents. Top assignee: Intel Corporation. Active years: 1997-2007.
Company Filing History:
Years Active: 1997-2007
Title: Altaf Hasan: Innovator in Integrated Circuit Packaging
Introduction
Altaf Hasan is a notable inventor based in Chandler, AZ (US), recognized for his contributions to the field of integrated circuit packaging. With a total of 3 patents to his name, he has made significant advancements that enhance the efficiency and reliability of packaging processes.
Latest Patents
One of Altaf's latest patents is focused on package warpage control. This innovative method involves placing a restrainer on a package during processing, clipping it in place, and exposing the package to high temperatures. After processing, the restrainer is removed, ensuring the integrity of the package. Another significant patent is related to TCP TAB design with radial outer leads. This integrated circuit package features a plurality of inner surface pads arranged in an angular pattern about the integrated circuit. The inner surface pads are coupled to the outer surface pads of the integrated circuit using TAB tape, which contains conductors that connect these pads effectively.
Career Highlights
Altaf Hasan is currently employed at Intel Corporation, where he continues to push the boundaries of innovation in packaging technology. His work has been instrumental in developing methods that improve the performance and reliability of electronic devices.
Collaborations
Throughout his career, Altaf has collaborated with talented individuals such as J D Wilson and Siva Natarajan. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Altaf Hasan's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in packaging technology, making him a valuable asset in the field.