Ismadi Bin Ismail

Title: The Innovative Contributions of Ismadi Bin Ismail

Introduction

Ismadi Bin Ismail is a notable inventor based in Kuching, Malaysia. He has made significant contributions to the field of technology, particularly in the area of component carriers. With a total of four patents to his name, Ismadi's work reflects a commitment to innovation and advancement in his field.

Latest Patents

Ismadi's latest patents include a "Solder mask arrangement for a component carrier." This invention features a component carrier system that includes a base solder mask layer and a top solder mask layer, designed to cover a target section of the component carrier. Another significant patent is "Stacking arrays and separator bodies during processing of component carriers on array level." This method involves processing component carriers by forming an alternating stack of arrays and separator bodies, facilitating efficient processing during back-end operations.

Career Highlights

Throughout his career, Ismadi has worked with prominent companies such as AT&S Austria Technologie & Systemtechnik Aktiengesellschaft and AT&S (Chongqing) Company Limited. His experience in these organizations has allowed him to hone his skills and contribute to various innovative projects.

Collaborations

Ismadi has collaborated with talented individuals in his field, including Valerian Yun Khim Chung and Alex Yucun Dou. These partnerships have further enriched his work and expanded the scope of his inventions.

Conclusion

Ismadi Bin Ismail's contributions to technology through his patents and collaborations highlight his role as an influential inventor. His innovative spirit continues to drive advancements in component carrier technology.