This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Jsr Corporation. Active years: 2017.
Company Filing History:
Years Active: 2017
Title: Isao Aritome: Innovator in Three-Dimensional Interconnection Technology
Introduction
Isao Aritome is a prominent inventor based in Tokyo, Japan. He is known for his significant contributions to the field of circuit arrangements and three-dimensional interconnections. His innovative work has led to the development of a patented method that enhances the efficiency and effectiveness of electronic components.
Latest Patents
Aritome holds a patent for a method for forming three-dimensional interconnections, which includes a circuit arrangement comprising three-dimensional interconnections and a metal film-forming composition. The patent describes a process where a contact plug is formed within a through hole in a substrate. This method allows for the electrical connection of an upper wire and a lower wire through the contact plug. A coating film is applied to the substrate, and a metal film is formed by heating the coating film. The process also involves plating to fill the through hole and a chemical mechanical polishing process to remove excess conductor deposited during plating. This innovative approach is crucial for advancing electronic circuit designs.
Career Highlights
Isao Aritome is associated with JSR Corporation, where he has made significant strides in research and development. His work has not only contributed to the company's portfolio but has also positioned him as a key figure in the field of electronic materials and technologies.
Collaborations
Aritome has collaborated with notable colleagues, including Sugirou Shimoda and Atsushi Kobayashi. These collaborations have fostered an environment of innovation and have led to advancements in their respective fields.
Conclusion
Isao Aritome's contributions to the field of three-dimensional interconnections exemplify the importance of innovation in technology. His patented methods are paving the way for future advancements in electronic circuit design.