Ill Heung Choi

Title: Ill Heung Choi: Innovator in Semiconductor Packaging

Introduction

Ill Heung Choi is a prominent inventor based in Cheonan, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 5 patents. His work focuses on innovative methods for manufacturing semiconductor packages that enhance performance and efficiency.

Latest Patents

Among his latest patents is a semiconductor package with semiconductor chips stacked therein. This patent describes a method of manufacturing a semiconductor package that involves preparing a first semiconductor chip with central electrode pads, a second semiconductor chip with edge electrode pads, and the process of stacking these chips together using metal bumps. Another notable patent is for an improved dual die package. This design features a first lead frame connected to a first semiconductor chip and a second lead frame connected to a second semiconductor chip. The electrical connection between the two is achieved through a wirebonding process, allowing for the use of conventional packaging equipment.

Career Highlights

Ill Heung Choi is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packaging, making it more efficient and reliable.

Collaborations

He collaborates with Young Hee Song, another talented professional in the field. Their combined expertise contributes to the development of cutting-edge technologies in semiconductor packaging.

Conclusion

Ill Heung Choi's contributions to semiconductor packaging through his innovative patents and work at Samsung Electronics Co., Ltd. highlight his importance in the field. His advancements are paving the way for future developments in semiconductor technology.