The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2005
Filed:
May. 28, 2002
Applicant:
Ill Heung Choi, Cheonan, KR;
Inventor:
Ill Heung Choi, Cheonan, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/495 ; H01L023/02 ; H01L023/48 ;
U.S. Cl.
CPC ...
Abstract
An improved dual die package is disclosed. The dual die package includes a first lead frame connected to a first semiconductor chip and a second lead frame connected to a second semiconductor chip. The first leads and the second leads are electrically connected to one another using a wirebonding process rather than a thermocompression process thereby allowing conventional packaging equipment to be used when manufacturing a dual die package.