Semiconductor package with semiconductor chips stacked therein and method of making the package

Abstract

A semiconductor package includes a first semiconductor chip, a second semiconductor chip, a substrate, and metal bumps. The first semiconductor chip has first central electrode pads along a center of the first semiconductor chip. The second semiconductor chip has second central electrode pads along a center of the second semiconductor chip and edge electrode pads along an edge of the second semiconductor chip. The metal bumps connect the first central electrode pads of the first semiconductor chip to the second central electrode pads of the second semiconductor chip. The second semiconductor chip is mounted on the substrate, and the edge electrode pads of the second semiconductor chip are electrically connected to the substrate. A method of manufacturing a semiconductor package includes: preparing the first and second semiconductor chips; attaching the second semiconductor chip to a substrate; connecting electrically the edge electrode pads of the second semiconductor chip to the substrate; encapsulating the connection between the edge electrode pads and the substrate; forming metal bumps on the central electrode pads of the second semiconductor chip; and stacking the first semiconductor chip on the second semiconductor chip so that the first central electrode pads of the first semiconductor chip attach to the respective second central electrode pads of the second semiconductor chip via the metal bumps.