Company Filing History:
Years Active: 2012-2015
Title: Iku Tokihisa: Innovator in Multilayer Printed Wiring Board Technology
Introduction
Iku Tokihisa is a prominent inventor based in Ibi-gun, Japan. He has made significant contributions to the field of printed wiring board technology, holding a total of 4 patents. His innovative designs and methods have advanced the manufacturing processes in this critical area of electronics.
Latest Patents
Tokihisa's latest patents include a multilayer printed wiring board and a method for manufacturing such boards. The multilayer printed wiring board features a first interlayer resin insulation layer, a first conductive circuit, and a second interlayer resin insulation layer with an opening portion. This design allows for a second conductive circuit and a via conductor that connects the first and second conductive circuits. Additionally, a coating layer with a metal layer and a coating film is formed between the first conductive circuit and the second interlayer resin insulation layer. The method for manufacturing this multilayer printed wiring board also emphasizes the importance of a protective film and a coating layer that enhances the functionality of the electronic components mounted on the pad.
Career Highlights
Iku Tokihisa is associated with Ibiden Company Limited, where he has been instrumental in developing advanced technologies in printed wiring boards. His work has not only contributed to the company's success but has also set new standards in the industry.
Collaborations
Throughout his career, Tokihisa has collaborated with talented individuals such as Sho Akai and Tatsuya Imai. These partnerships have fostered innovation and have led to the successful development of new technologies in the field.
Conclusion
Iku Tokihisa's contributions to multilayer printed wiring board technology exemplify his dedication to innovation and excellence. His patents and collaborative efforts continue to influence the electronics industry positively.