The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
Dec. 09, 2011
Applicants:
Sho Akai, Ibi-gun, JP;
Tatsuya Imai, Ibi-gun, JP;
Iku Tokihisa, Ibi-gun, JP;
Inventors:
Assignee:
Ibiden Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.