Ichirou Anjou

Title: Ichirou Anjou: Innovator in Semiconductor Technology

Introduction

Ichirou Anjou is a prominent inventor based in Koganei, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving the reliability and efficiency of semiconductor devices.

Latest Patents

One of Ichirou Anjou's latest patents is a method of making a semiconductor device that incorporates a stress-relieving mechanism. This innovative method involves forming a multi-layered wiring structure that includes a conductor layer designed for electrical connection to a packaging substrate. The structure features ball-like terminals arranged in a grid array on the surface, enhancing the device's performance. The inclusion of a buffer layer helps to relieve thermal stress during the packaging process, resulting in improved connection reliability and reduced noise during operation. This advancement allows for shorter wiring distances, which in turn increases signal speed and the number of terminals per unit by eliminating the need for wire bonding. The buffer layer can be made from an elastomer with a modulus of elasticity of 10 kg/mm or less.

Career Highlights

Ichirou Anjou has had a distinguished career, working with notable companies such as Hitachi, Ltd. and Hitachi ULSI Engineering Corporation. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Throughout his career, Ichirou Anjou has collaborated with esteemed colleagues, including Masahiko Ogino and Akira Nagai. These partnerships have fostered a collaborative environment that has led to significant advancements in their field.

Conclusion

Ichirou Anjou's contributions to semiconductor technology demonstrate his innovative spirit and commitment to enhancing device performance. His patents reflect a deep understanding of the challenges in the industry and a dedication to finding effective solutions.