I-Min Lin

Title: I-Min Lin: Innovator in Wiring Structures

Introduction

I-Min Lin is a notable inventor based in Taipei County, Taiwan. He has made significant contributions to the field of wiring structures, particularly in improving crown-like defects. With a total of 2 patents, his work showcases innovative methods that enhance the reliability and efficiency of wiring systems.

Latest Patents

I-Min Lin's latest patents focus on a fabrication method of wiring structures aimed at improving crown-like defects. The first patent describes a method that begins with providing a substrate, on which a seed layer and a patterned photoresist layer with an opening are formed. A copper layer is then created, covering the seed layer within the opening. Following this, a barrier layer is applied to at least one top portion of the copper layer, ensuring that its oxidation potential is greater than that of the copper layer. The process continues with the removal of the patterned photoresist layer, leading to an etching process that forms a wiring layer. Finally, an immersion process is performed to create an anti-oxidation layer on the exposed surfaces of both the barrier layer and the wiring layer.

Career Highlights

I-Min Lin is currently associated with Xintec Corporation, where he continues to develop innovative solutions in wiring technology. His expertise and dedication to improving electronic components have made him a valuable asset in the industry.

Collaborations

I-Min Lin has collaborated with notable coworkers, including Yi-Ming Chang and Po-Shen Lin. Their combined efforts contribute to the advancement of technology in their field.

Conclusion

I-Min Lin's contributions to the field of wiring structures demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in electronic design, making him a prominent figure in the industry.