Hyunil Bae

Title: Hyunil Bae: Innovator in Semiconductor Technology

Introduction

Hyunil Bae is a prominent inventor based in Kyoungki-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative semiconductor devices and packaging methods that enhance performance and efficiency.

Latest Patents

Hyunil Bae's latest patents include a semiconductor device and method of forming a package with a double-sided integrated passive device. This invention features a semiconductor die, substrate, and a plurality of first conductive pillars. The design allows for an electrical component to be disposed over the semiconductor die, with a shielding frame and multiple conductive pillars enhancing its functionality.

Another notable patent is the semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias. This invention involves a first semiconductor die with contact pads and through-silicon vias, allowing for efficient communication with a second semiconductor die mounted on it. The encapsulation and interconnect structure further improve the device's reliability and performance.

Career Highlights

Hyunil Bae is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

He collaborates with talented coworkers such as YoungChul Kim and Myungkil Lee, contributing to a dynamic team focused on cutting-edge semiconductor solutions.

Conclusion

Hyunil Bae's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a key innovator in the field. His work continues to influence the development of advanced semiconductor devices, showcasing the importance of innovation in technology.