Hyung Jun Park

This inventor holds 7 USPTO granted patents and 2 published patent applications. Top assignees: Advanced Semiconductor Engineering, Inc., National Science Council. Active years: 2001-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hyung Jun Park. Retrieved from https://idiyas.com/inventor/hyung-jun-park-k1kt0co2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 7 (Patent Applications = 2)

% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 468(Granted Patents)

Location History:

Kyunggi-do, KR (2001 - 2002)
Koyang-si, KR (2005)
Paju-Si, KR (2004 - 2007)

Company Filing History:

6 out of 1,971

Advanced Semiconductor Engineering, Inc.

patents

1 out of 544

National Science Council

patents

Years Active: 2001-2007

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7 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7205658 - Singulation method used in leadless packaging process (2007-04-17),

2. 6861295 - Low-pin-count chip package and manufacturing method thereof (2005-03-01),

3. 6773961 - Singulation method used in leadless packaging process (2004-08-10),

4. 6489218 - Singulation method used in leadless packaging process (2002-12-03),

5. 6355502 - Semiconductor package and method for making the same (2002-03-12),

6. 6342730 - Low-pin-count chip package and manufacturing method thereof (2002-01-29),

7. 6242284 - Method for packaging a semiconductor chip (2001-06-05),

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: