The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2001
Filed:
May. 05, 2000
Kun-A Kang, Seoul, KR;
Kyujin Jung, Kyunggi-do, KR;
Hyung Jun Park, Kyunggi-do, KR;
Jun Hong Lee, Kyunggi-Do, KR;
Advanced Semiconductor Engineering, Inc., Taiwan, TW;
Abstract
A method for packaging a semiconductor chip, generally comprising the following steps of: (a) forming a plurality of openings on the top surface of the conducting substrate, wherein the upper portions of the openings are formed larger than the lower portions of the openings; (b) forming insulating sections in the conducting substrate by filling an insulating material in the openings; (c) forming a plurality of leads insulated by the insulating sections by planarizing the bottom surface of the conducting substrate to expose and form planarized bottom surfaces of the insulating sections; (d) mounting a semiconductor chip on the bottom surface of the conducting substrate; (e) providing a plurality of conducting wires to electrically connect the semiconductor chip to the leads; and (f) encapsulating the semiconductor chip and the conducting wires. The package according to the present invention is characterized by upper portions of the leads that are purposedly formed larger than lower portions of the leads which prevents the leads from being easily detachable and the package from being destructed by water, the reliability of the package is thus increased.